Semiconductor module arrangement and method for producing a semiconductor module arrangement

ABSTRACT

A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.

PRIORITY CLAIM

This application claims priority to German Patent Application No. 102013 100 701.5, filed on 24 Jan. 2013, the content of said Germanapplication incorporated herein by reference in its entirety.

TECHNICAL FIELD

The invention relates to a semiconductor module arrangement and to amethod for producing a semiconductor module arrangement.

BACKGROUND

When fitting semiconductor modules, it is usually necessary to fitseveral subassemblies to one another. In the process, a very widevariety of tolerances can occur, for example when fitting holes arelarger than fastening screws. If three or more subassemblies of asemiconductor module arrangement are fitted to one another, theindividual assembly tolerances can add up. This can lead to fitting offurther subassemblies being more difficult.

SUMMARY

According to embodiments described herein, a semiconductor modulearrangement and a method for producing a semiconductor modulearrangement are provided, in which three or more subassemblies of thesemiconductor module arrangement are or can be fitted with a high levelof accuracy in respect to positioning in relation to one another.

The semiconductor module arrangement which is to be produced has a firstsubassembly, a second subassembly and a third subassembly. The thirdsubassembly comprises a quantity of adjustment pins which are fixedlyconnected to one another, the first subassembly comprises a number N1 offirst adjustment openings, and the second subassembly comprises a numberN2 of second adjustment openings. Each of the adjustment pins engagesinto one of the first adjustment openings and/or into one of the secondadjustment openings.

Since the adjustment pins, as a constituent part of the thirdsubassembly, are fixedly connected to one another and serve to adjustboth the first subassembly and the second subassembly relative to thethird subassembly, they ensure a high degree of accuracy in respect offitting for the first subassembly in relation to the second subassembly.

In this case, one, several or all of the adjustment pins can engage ineach case only into one adjustment opening in the first subassembly orin the second subassembly, or else both into an adjustment opening inthe first subassembly and also into an adjustment opening in the secondsubassembly.

In the first-mentioned case, the third subassembly can optionally have anumber N1≧1 of first adjustment pins and a number N2≧1 of secondadjustment pins, the first subassembly can comprise a number N1 of firstadjustment openings into which in each case a different one of the firstadjustment pins engages, and the second subassembly can have a number N2of second adjustment openings into which in each case a different one ofthe second adjustment pins engages. In this case, the totality of the N1first adjustment pins and the N2 second adjustment pins can form thequantity of adjustment pins which are fixedly connected to one another.

When producing semiconductor module arrangements of this kind, the firstsubassembly, the second subassembly and the third subassembly areinitially provided as assemblies which are independent of one anotherand are not connected to one another. In this case, all of theadjustment pins from amongst the quantity of adjustment pins which arefixedly connected to one another constitute an integral constituent partof the third subassembly and as a result are fixedly connected to oneanother. As a result, the first subassembly, the second subassembly andthe third subassembly are arranged relative to one another in such a waythat each of the adjustment pins engages into one of the firstadjustment openings and/or into one of the second adjustment openings.

Those skilled in the art will recognize additional features andadvantages upon reading the following detailed description, and uponviewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is described below using exemplary embodiments withreference to the appended figures. In the figures, identical referencesymbols indicate identical elements with the same function. Unlessstated otherwise, the elements, features, methods and method steps shownin the various figures can be combined with one another in any desiredmanner provided that they are not mutually exclusive.

FIG. 1A shows a cross section through a plurality of subassemblies of asemiconductor module arrangement, which subassemblies are to be fittedto one another.

FIG. 1B shows a cross section through a semiconductor module of thearrangement according to FIG. 1A, and also an enlarged section of thissemiconductor module.

FIG. 1C shows a cross section through the subassemblies which are fittedto one another with the aid of adjustment pins.

FIG. 2 shows a perspective exploded illustration of the semiconductormodule arrangement according to FIG. 1C, with the additionalillustration of connecting screws.

FIG. 3 shows a plan view of the semiconductor module arrangementaccording to FIG. 1C.

DETAILED DESCRIPTION

FIG. 1A shows several subassemblies 4, 7, 10, 200 and 300, at leastthree of the subassemblies being connected to one another in order toproduce a semiconductor module arrangement.

Subassembly 4 is a solid, for example metal, base plate. The base plate4 can have, for example, a thickness of at least 2 mm. The base plate 4can be composed, for example, of metal or of a metal matrix compositematerial (MMC). The base plate 4 can optionally be provided with a thincoating on its top face. A coating of this kind can serve, for example,to improve the ability to solder the base plate 4, it being possible forthis to be achieved with a nickel coating for example. A thin coatingcan, however, also serve to make it easier to establish a sinteredconnection. In this case, the coating can be composed, for example, of anoble metal such as silver or gold.

The base plate 4 can optionally be populated with one or more circuitmounts 2, it being possible for each of the circuit mounts 2, for itspart, to be populated with one or more semiconductor chips 5 on its facewhich is averted from the base plate 4. It is also possible for onlyprecisely one, precisely two or else more than three circuit mounts 2 tobe provided instead of the shown three circuit mounts 2. The assemblagecomprising the base plate 4 and the at least one populated circuit mount2 constitutes a main semiconductor module 100′.

In each case, a construction of this kind serves to dissipate the lostheat which is produced during operation of the finished semiconductormodule arrangement, in particular in the semiconductor chips 5, to aheat sink 300 via the respective circuit mount 2, which is situatedbeneath the semiconductor chip 5, and the base plate 4. To this end, theheat sink 300 is placed in thermal contact with that face of the baseplate 4 which is averted from the semiconductor chips 5. In order toimprove the thermal coupling between the base plate 4 and the heat sink300 in this case, a thermally conductive paste can be introduced betweenthe base plate 4 and heat sink 300. The heat sink 300 constitutes aseparate subassembly. A housing 7, a housing cover 10 and a printedcircuit board 200 can be present as further subassemblies.

FIG. 1B shows a main semiconductor module 100 which is formed by fittingthe housing 7 and the cover 10 to the main module 100′. The cover 10 is,however, optional, that is to say it can also be omitted. Similarly, thecover 10 can also be in the form of a fixed constituent part of thehousing 7.

A section of the semiconductor module 100 or of the main module 100′from the region of one of the circuit mounts 2 is illustrated on anenlarged scale in FIG. 1B. However, the construction in the region ofthe other circuit mounts 2 is identical in principle. At least onesemiconductor chip 5 is arranged on each of the circuit mounts 2.

The semiconductor chips 5 each have a semiconductor body 50 which isprovided with an upper contact metallization 51 and a lower contactmetallization 52. A semiconductor chip 5 of this kind can be, forexample, a controllable semiconductor switch, for example a MOSFET, anIGBT, a JFET, a thyristor or any desired other controllablesemiconductor switch, or a non-controllable semiconductor switch, suchas a diode for example. The upper and lower contact metallizations 51,52, respectively, can form, for example, source and drain, drain andsource, emitter and collector, collector and emitter, anode and cathodeor cathode and anode. If a semiconductor chip 5 is a controllablesemiconductor switch, it has a control connection, that is to say a gateconnection or a base connection, which is formed by a furthermetallization (not illustrated) which can be located on the top face ofthe semiconductor body 50 next to the upper contact metallization 51 andelectrically insulated from the upper contact metallization 51, or canbe located on the bottom face of the semiconductor body 50 next to thelower contact metallization 52 and electrically insulated from the lowercontact metallization 52.

The base semiconductor module 100′ can have, for example, precisely oneor else several individual semiconductor switches. It is likewisepossible, for example, for two individual switches to be connected inseries so as to form a half-bridge. In this case, one semiconductormodule 100 can contain, for example, precisely one, precisely two,precisely three or else more than three half-bridges of this kind. Inprinciple however, a circuit mount 2 can be populated in any desiredmanner.

Each of the circuit mounts 2 has a dielectric insulation carrier 20which is provided with an upper metallization layer 21 on its top face.The upper metallization layer 21 can be patterned or unpatterned. Theinsulation carrier 20 can optionally be provided with a lowermetallization layer 22 on its bottom face which is averted from theupper metallization layer 21. In this case, the upper metallizationlayer 21 and the lower metallization layer 22 can be electricallyinsulated from one another.

The upper metallization layer 21 and/or—if provided—the lowermetallization layer 22 can be composed, for example, of copper, a copperalloy, aluminum, an aluminum alloy, but also any other metal. Theinsulation carrier 20 can be in the form of, for example, ceramic and becomposed of, for example, aluminum oxide, aluminum nitride or siliconnitride. The circuit mount 2 may be, for example, a DCB (direct copperbonding) substrate, a DAB (direct aluminum bonding) substrate or an AMB(active metal brazing) substrate. However, it is likewise possible touse a conventional printed circuit board (PCB) as the circuit mount 2.

As can be seen from the section which is illustrated on an enlargedscale, the semiconductor chips 5 are connected to the circuit mount 2,on which they are respectively arranged, with the aid of a connectinglayer 15. In this case, the connecting layer 15 makes direct contactboth with the lower contact metallization 52 of the semiconductor chip 5and also with the upper metallization layer 21 of the correspondingcircuit mount 2.

If a base plate 4 is provided, each of the circuit mounts 2 iscohesively connected to the base plate 4 with the aid of a connectinglayer 16. In this case, the connecting layer 16 makes direct contactboth with the lower metallization layer 22 of the corresponding circuitmount 2 and also with the base plate 4.

The connecting layers 15, 16 can be in the form of solder layers or inthe form of sintered connecting layers, independently of one another andin any desired combinations with one another. In the case of a sinteredconnecting layer, the sintered connecting layer can contain, forexample, a sintered silver powder.

The housing 7 can provide electrical insulation. The housing 7 can becomposed, for example, of thermosetting or thermoplastic material. Ahousing 7 of this kind can be produced, for example, by means of aninjection-molding technique. The housing 7 has a side wall 70 which canoptionally also be of annular form and which surrounds, in particular,the circuit mount or mounts 2 and also the semiconductor chip or chips 5which is/are arranged on the circuit mount or mounts 2.

Electrical connection contacts 3, 913, 923, 933 are provided in order toelectrically connect the finished semiconductor module to externalcomponents. A load current flows through each of the semiconductor chips5 during operation of the finished semiconductor module. For thispurpose, a “load current” is understood to be a current through asemiconductor chip 5 which current flows through the semiconductor body50 between source and drain, between emitter and collector or betweenanode and cathode, that is to say between the upper contactmetallization 51 and the lower contact metallization 52. Since loadcurrents of this kind can assume very high values in semiconductormodules, it is necessary for the associated electrical connectioncontacts to have a high current-carrying capacity. This is achieved by alarge conductor cross section of the connection contacts. In theexemplary embodiment shown, the connection contacts 913, 923, 933, whichare in the form of stamped and bent metal sheets, constitute some of theload connection contacts. The connection contacts 913, 923, 933 areelectrically conductively connected, for example by means of a solderedconnecting layer or a sintered connecting layer as explained above, toan upper metallization layer 21 of a circuit mount 2 or to the uppercontact metallization 51 of a semiconductor chip 5.

In addition to connection contacts 913, 923, 933 through which a loadcurrent flows through one or more semiconductor chips 5, one or moreadditional connection contacts 3 are also present, the additionalconnection contacts 3 serving to transmit small signals, as arerequired, for example, to actuate control connections of a semiconductorchip 5 or to transmit further signals which transmit information aboutthe state of the semiconductor module, such as the temperature of asemiconductor chip 5 for example.

These additional connection contacts 3 are in the form of substantiallystraight pins which have a free first end 31 and also a second end 32which is opposite the first end 31. The second ends 32 are each insertedinto an electrically conductive, for example metal, sleeve 6 and in thisway electrically conductively connected to the corresponding sleeve 6.The sleeves 6, for their part, are electrically conductively connected,for example by soldering, to the upper metallization layer 21 of one ofthe circuit mounts 2. An electrically conductive connection between aconnection pin 3 and a conductor track which is formed in the uppermetallization layer 21 can be realized in this way. Over its furthercourse, a conductor track of this kind can be connected to any desiredelectrical potentials of the circuit which is realized on the circuitmount 2. Bonding wires 8 can likewise optionally be used for thispurpose, as for producing any other desired electrical connections.

As explained, the additional connection contacts 3 are suitableprimarily for transmitting small electrical signals. However, it islikewise possible to connect two or more connection contacts 3 of thiskind electrically in parallel and as a result to increase thecurrent-carrying capacity, so that the parallel circuit comprising thetwo or more connection contacts 3 can also be used as a load connectionfor transmitting a load current which flows through one or moresemiconductor chips 5.

The additional connection contacts 3 can optionally each have a press-inregion 33 which is pressed into a contact hole 211 (see FIG. 1A) in theprinted circuit board 200 and in the process is plastically deformed, sothat an electrical press-in connection is established between theconnection contact 3 and the printed circuit board 200. A press-inconnection of this kind can be formed or established, in particular, inaccordance with DIN EN 60352-5, as at April 2004.

If a housing cover 10 is provided at all, the additional connectioncontacts 3 can be routed through corresponding passage openings 11 (seeFIG. 1A) in the housing cover 10, so that the free ends 31 and thepress-in regions 33 project out of the passage openings 11 in thehousing cover 10 on that face of said housing cover which is avertedfrom the semiconductor chip or chips 5.

The housing cover 10 can optionally have a respective insertion funnel111 on that face of the passage openings 11 which faces the base plate4. The input opening (that is to say the width of the opening of theinsertion funnel 111 at that end from which the connection contacts 3are pushed into the insertion funnel 111, that is to say on the bottomface in this case) of the insertion funnel 111 is larger than an inputopening of the passage openings 11 (that is to say the width of theopening of the passage opening 11 at that end from which the connectioncontacts 3 are pushed into the passage opening 11, that is to say on thebottom face in this case). Insertion funnels 111 of this kind ensurethat the free first ends 31 are received and inserted into the passageopenings 11 when the housing cover 10 is mounted.

As explained, the printed circuit board 200 is provided with electricalcontact openings 211. The contact openings 211 can, for example, be inthe form of metallized passage openings, the metallization of thepassage openings 211 being electrically connected to conductor tracks(not illustrated here) of the printed circuit board 200. Conductortracks of this kind can be located, for example, on the upper faceand/or on the lower face, but in addition or as an alternative also inthe interior, of the printed circuit board 200. Since the contactopenings 211 are smaller than the press-in regions 33 before theconnection contacts 3 are pressed in, the press-in regions 33 areplastically deformed by the pressing-in process.

In order to allow accurate relative positioning of at least three of thesubassemblies, base plate 4 (not populated, or else as a constituentpart of an above-described main semiconductor module 100′), housing 7(with or without housing cover 10), housing cover 10, printed circuitboard 200 and heat sink 300, a third of the at least threesubassemblies, in this case the housing 7, has a quantity of adjustmentpins 71, 72 which are fixedly connected to one another. Each of theadjustment pins 71, 72 engages into a different one of one or more firstadjustment openings 43 in a first subassembly (4) of the at least threesubassemblies, in this case the base plate 4, and/or into a differentone of one or more second adjustment openings 201 of a secondsubassembly (200) of the at least three subassemblies, the result ofthis being illustrated in FIG. 1C.

This includes a first alternative which is shown in FIG. 1C, accordingto which the quantity of adjustment pins 71, 72 which are fixedlyconnected to one another can be divided into two pin groups: into afirst pin group with one or more first adjustment pins 71 and into asecond pin group with one or more second adjustment pins 72, wherein thefirst adjustment pins 71 each engage into first adjustment openings 43in the first subassembly 4, and the second adjustment pins 72 eachengage into second adjustment openings 201 in the second subassembly200. The adjustment pins 71 of the first pin group therefore engage intoadjustment openings 43 in a (first) subassembly (4) which is differentfrom the (second) subassembly (200), the adjustment pins 72 of thesecond pin group engaging into the adjustment openings 201 in the secondsubassembly 200.

According to a second alternative which is likewise shown in FIG. 10,from amongst the quantity of adjustment pins (in this case: 71) of thethird subassembly, in this case the housing 7, it is possible for eachof the adjustment pins 71 to also engage both into an adjustment opening43 (see FIG. 1A) in the first subassembly, in this case the base plate4, and into an adjustment opening 301 in the second subassembly, in thiscase the heat sink 300.

Since the housing cover 10 and the side wall 70 are present as separatecomponents in the example shown, the second alternative is optionallyrealized for a second time in FIG. 1C by, from amongst the quantity ofadjustment pins (in this case: 72) of the third subassembly, in thiscase the housing 7, each of the adjustment pins 72 engaging both into anadjustment opening 12 (see FIG. 1A) in the first subassembly, in thiscase the housing cover 10, and into an adjustment opening 201 in thesecond subassembly, in this case the printed circuit board 200.

The totality of the first alternative and the second alternativetherefore involves, in principle, that is to say not only in the presentexample but in all other refinements of the invention, the quantity ofadjustment pins which are fixedly connected to one another (in theexample: 71 with 72 in the first alternative and 71 or 72 in the twosecond alternatives) are a constituent part of a third subassembly and,in their totality, serve to engage both into adjustment openings in afirst subassembly and in a second subassembly, so that (at least) thefirst, the second and the third subassemblies can be positioned relativeto one another.

The examples which are explained in the figures are intended merely toillustrate the principle of the invention. In the example in FIGS. 1A to1C for explaining the first alternative, the third subassembly, that isto say the subassembly which contains the quantity of adjustment pins71, 72, is provided by the housing 7. However, it is possible for thethird subassembly to also be provided by any desired other subassemblyof the semiconductor module arrangement in the two alternatives.Similarly, the first subassembly and the second subassembly can be anydesired other subassemblies of the semiconductor module arrangement. Itis important only that the first, the second and the third of the atleast three subassemblies are separate assemblies which are differentfrom one another before they are fitted to one another. Therefore, thefirst subassembly, the second subassembly and the third subassembly canbe chosen as desired, in particular, from the following assemblies: (I)in the form of a base plate (4), populated or unpopulated; (II) in theform of a housing (7) with or without a housing cover (10); (III) in theform of a housing cover (10); (IV) in the form of a heat sink (300); (V)in the form of a printed circuit board (200). Furthermore, it isimportant for all of the adjustment pins 71, 72 of the third subassemblyto also be fixedly connected to one another and therefore form a stableunit when the subassemblies are not yet connected to one another, thatis to say in particular when the third subassembly is present as aseparate part.

In all of the refinements in which one of the subassemblies is providedby a base plate 4, the base plate 4 can be unpopulated, but alsopopulated. For example, the base plate 4 can be cohesively connected toone or more circuit mounts 2, each of which, for its part, is cohesivelyconnected to a semiconductor chip 5 which is located on that face of thecircuit mount 2 which is averted from the base plate 4.

Furthermore, a third subassembly, including the quantity of adjustmentpins, can be integrally formed and in this case optionally be composedof a uniform, homogeneous material. In this case, the material can beelectrically insulating or electrically conductive. For example, in thearrangement according to FIG. 1C, the adjustment pins 71, 72 and thehousing side wall 70 can be produced together in combination by aninjection-molding process.

In the first alternative which is explained using FIG. 1C, the firstadjustment pins 71 can extend away from a main body (70) of the thirdsubassembly 7 in a first direction r1, and the second adjustment pins 72can extend away from the main body 70 in a second direction r2 which isopposite to the first direction r1.

As is further shown by way of example in FIG. 1C, one, several or eachof the N1 first adjustment pins 71 and/or one, several or each of the N2second adjustment pins 72 can be in the form of a blade pin. In thiscase, a ‘blade pin’ is to be understood to be a pin which has anon-circular outer circumference in a sectional plane transverse to thedirection r1 or r2 in which it extends, so that the pin, when it isinserted into a cylindrical opening, has a press fit in a first radialdirection which is perpendicular to the insertion direction, and hasslight play in a second radial direction which is perpendicular both tothe insertion direction and also to the first radial direction. As aresult, the blade pin is therefore subject to play only in a radialdirection, this leading to a particularly high level of accuracy inrespect of adjustment.

Furthermore, all of the adjustment pins 71, 72 which are fixedlyconnected to one another, can be formed without a thread in all of therefinements of the invention.

It is optionally possible, both in the first alternative and in thesecond alternative, for there to also be one or more furthersubassemblies, in addition to the first subassembly, the secondsubassembly and the third subassembly, each of said furthersubassemblies having one or more adjustment openings into which in eachcase one of the quantity of adjustment pins of the third subassemblyengages after all of the subassemblies are fitted.

Both in the first alternative and in the second alternative, the firstsubassembly can have a number N1 of first adjustment openings, whereinN1 can be equal to 1 or greater than 1, and the second subassembly canhave a number N2 of second adjustment openings, wherein N2 can also beequal to 1 or greater than 1.

FIG. 2 further shows an exploded illustration of the arrangementaccording to FIG. 1C, wherein different screws for fastening theelements to one another are additionally illustrated. Screws 502 whichengage into passage openings 202 in the printed circuit board 200 serveto secure the printed circuit board 200 to the semiconductor module 100.Further screws 503 serve, in connection with optional washers 513, toscrew the power semiconductor module 100 to the base plate 4 usingthreaded holes 303 in a heat sink 300 by the screws 503 being passedthrough fitting openings 43 in the base plate 4 and being screwed intothe threaded holes 303. Corresponding securing screws can also be usedin all of the other refinements.

FIG. 3 further shows a plan view of the semiconductor module arrangementwhich is shown in FIG. 1C, but without the screws 502, 503 which areshown in FIG. 2 and also without the heat sink 300. The sectional planeE-E′ which is associated with FIGS. 1A to 1C is likewise illustrated.

As can also be gathered from the view according to FIGS. 2 and 3, thesemiconductor module 100 can have further load connection contacts 911,921, 931, for example for connecting a positive supply voltage, and alsofurther load connection contacts 912, 922, 932, for example forconnecting a negative supply voltage. These connection contacts 911,912, 921, 922, 931, 932, like the connection contacts 913, 923, 933, canbe in the form of stamped and bent metal sheets and be connected to oneor more of the circuit mounts 2.

Spatially relative terms such as “under”, “below”, “lower”, “over”,“upper” and the like, are used for ease of description to explain thepositioning of one element relative to a second element. These terms areintended to encompass different orientations of the device in additionto different orientations than those depicted in the figures. Further,terms such as “first”, “second”, and the like, are also used to describevarious elements, regions, sections, etc. and are also not intended tobe limiting. Like terms refer to like elements throughout thedescription.

As used herein, the terms “having”, “containing”, “including”,“comprising” and the like are open-ended terms that indicate thepresence of stated elements or features, but do not preclude additionalelements or features. The articles “a”, “an” and “the” are intended toinclude the plural as well as the singular, unless the context clearlyindicates otherwise.

With the above range of variations and applications in mind, it shouldbe understood that the present invention is not limited by the foregoingdescription, nor is it limited by the accompanying drawings. Instead,the present invention is limited only by the following claims and theirlegal equivalents.

What is claimed is:
 1. A semiconductor module arrangement, comprising: afirst subassembly having a number N1 of first adjustment openings; asecond subassembly having a number N2 of second adjustment openings; anda third subassembly having a plurality of adjustment pins which arefixedly connected to one another, wherein a first set of the pluralityof adjustment pins extend beyond a top surface of the third assembly,wherein a second set of the plurality of adjustment pins extend beyond abottom surface of the third assembly, wherein each pin of the first setof the plurality of adjustment pins is vertically aligned with acorresponding pin of the second set of the plurality of adjustment pinsto form a pair of vertically aligned adjustment pins, wherein each ofthe first set of the plurality of adjustment pins engages into one ofthe first adjustment openings, wherein each of the second set of theplurality of adjustment pins engages into one of the second adjustmentopenings, wherein the plurality of adjustment pins constitutes anintegral constituent part of the third subassembly prior to thesubassemblies being connected to one another.
 2. The semiconductormodule arrangement of claim 1, wherein: the third subassembly has anumber N1≧1 of the first set of the plurality of adjustment pins; thefirst subassembly has a number N1 of first adjustment openings intowhich in each case a different one of the first set of the plurality ofadjustment pins engages; the third subassembly has a number N2≧1 of thesecond set of the plurality of adjustment pins; the second subassemblyhas a number N2 of second adjustment openings into which in each case adifferent one of the second set of the plurality of adjustment pinsengages; and the totality of the N1 first set of the plurality ofadjustment pins and the N2 second set of the plurality of adjustmentpins forms the quantity of adjustment pins which are fixedly connectedto one another.
 3. The semiconductor module arrangement of claim 1,wherein the first subassembly, the second subassembly and the thirdsubassembly are in each case a different one of the followingsubassemblies I to V: (I) a base plate; (II) a housing; (III) a housingcover; (IV) a heat sink; and (V) a printed circuit board.
 4. Thesemiconductor module arrangement of claim 3, wherein the base plate iscohesively connected to a circuit mount which is cohesively connected toa semiconductor chip, and wherein the semiconductor chip is arranged ona face of the circuit mount which is averted from the base plate.
 5. Thesemiconductor module arrangement of claim 1, wherein the thirdsubassembly is integrally formed and is composed of a uniform,homogeneous material.
 6. The semiconductor module arrangement of claim5, wherein the uniform, homogeneous material is a metal or a plastic ora molding compound.
 7. The semiconductor module arrangement of claim 2,wherein: the third subassembly has a main body; the first set of theplurality of adjustment pins extend away from the main body in a firstdirection; and the second set of the plurality of adjustment pins extendaway from the main body in a second direction opposite to the firstdirection.
 8. The semiconductor module arrangement of claim 7, whereinthe main body is an annular plastic frame of a housing in which asemiconductor chip is arranged.
 9. The semiconductor module arrangementof claim 1, wherein: the first subassembly is a base plate cohesivelyconnected to a circuit mount; the circuit mount is cohesively connectedto a semiconductor chip which is arranged on a face of the circuit mountwhich is averted from the base plate; and the second subassembly is aprinted circuit board.
 10. The semiconductor module arrangement of claim8, further comprising: a heat sink having a number N1 of furtheradjustment openings into which in each case a different one of theadjustment pins engages.
 11. The semiconductor module arrangement ofclaim 2, wherein: one, several or each of the N1 first set of theplurality of adjustment pins is a blade pin; and/or one, several or eachof the N2 second set of the plurality of adjustment pins is a blade pin.12. The semiconductor module arrangement of claim 1, wherein all of theadjustment pins are devoid of a thread.
 13. The semiconductor modulearrangement of claim 1, wherein the plurality of adjustment pins isplastic molded to a sidewall of the third subassembly.